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    Faq
    Home > Faq > Production process

    1 chip cleaning:

    Objective to remove the dirt, oil from the chip surface grinding residual flow, to ensure that the silver (gold) layer firmly attached good.

    2 steamed (silver):

    The vacuum coating principle is used to evaporate the thin silver (gold) layer on the clean quartz chip, and the lead electrode is formed, and the frequency is reached to a certain range.

    3 shelves dispensing:

    On the base of the chip which is plated with silver (gold) electrodes, conductive adhesive and high temperature curing, the chip is coated with a gold plated Pad (DIP).

    4 fine tune:

    Using the vacuum coating principle, the silver (gold) is plated on the surface of the chip, and the frequency of the crystal resonator is achieved. (pin class products are used)

    The gold (silver) electrode, which uses the Ar ion, to etch the excess gold (Ag) atoms, to achieve the required frequency of the crystal resonator. (more suitable for the use of small SMD products)

    5 sealing:

    The base and the upper cover are placed in nitrogen filled (or vacuum) of welding environment, to ensure the products meet the requirements of the aging rate.

    The main sealing way:

    The resistance welding

    The piping welding (Seam)

    - the glass welding (Frit)

    Welding - Sikkim (AuSn)

    6 seal inspection:

    To confirm whether the leakage phenomenon after sealing products.

    According to the leak detection method to distinguish:

    A. thick leakage: check the large leakage phenomenon, common detection method has the bubble type and pressure difference type.

    B.: a small leakage check leakage phenomenon, commonly used detection method for helium leak detection type.

    7 aging and simulated reflow:

    Old: the product to be high temperature for a long time, the process of the process of thermal processing due to the stress of the release effect.

    Reflow soldering: in order to simulate the use of the environment, the purpose of the use of the environment, in order to improve the availability of manufacturing defects.

    8 test:

    Printing, electrical performance index test for product, eliminate bad products, ensure the quality of products.

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